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Measurement of interface-state-density distribution near conduction band at interface between atomic-layer-deposited Al2O3 and silicon-doped InAlN

机译:原子层沉积Al2O3与掺硅InAlN界面处导带附近界面态密度分布的测量

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摘要

The Al2O3/InAlN interface formed by atomic layer deposition on a sufficiently thick silicon-doped InAlN layer lattice matched to GaN was investigated electrically. A metal-oxide-semiconductor (MOS) diode fabricated through careful interface formation showed a minimized leakage current and a capacitance-voltage (C-V) characteristic with a capacitance change large enough to evaluate the interface-state density, in the range of 10(12) eV(-1) cm(-2), near the conduction band. However, the MOS diode with careless interface formation resulted in degraded electrical characteristics, which indicated the process dependence of the interface properties. The effects of the acceptor-like interface states on the C-V curves are discussed. (C) 2013 AIP Publishing LLC.
机译:对通过原子层沉积在与GaN匹配的足够厚的掺Si的InAlN层晶格上形成的Al2O3 / InAlN界面进行了电学研究。通过仔细的界面形成制造的金属氧化物半导体(MOS)二极管显示出最小的泄漏电流和电容-电压(CV)特性,其电容变化足以评估界面态密度,范围为10(12) )eV(-1)cm(-2),在导带附近。然而,具有粗心界面形成的MOS二极管会导致电特性下降,这表明界面特性与工艺有关。讨论了类受体界面状态对C-V曲线的影响。 (C)2013 AIP Publishing LLC。

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